Innovative power, unlocking the limits of thermal energy: 7.5W/mK high thermal conductivity insulating sheet TIF™ 500-75-11U

The latest masterpiece of our product line - TIF™ 500-75-11U high-performance thermal insulation sheet. This product features a leading industry thermal conductivity of 7.5W/mK as its core highlight. It is designed to provide a one-stop solution with outstanding heat dissipation, reliable insulation, and convenient installation for high heat flux devices in cutting-edge fields such as 5G communication, electric drive and control of new energy vehicles, high-performance servers, and high-end consumer electronics.

Performance Peak: Establishing a New Standard of 7.5W/mK for High-Efficiency Heat Dissipation

The core breakthrough of TIF™ 500-75-11U lies in its outstanding thermal conductivity. Thanks to its unique ceramic-filled silicone rubber formulation system, the product achieves a thermal conductivity of up to 7.5W/mK (according to ASTM D5470), a significant improvement compared to the previous generation of the same series. This means that heat can be conducted from the heat source (such as CPU, GPU, power module) to the heat sink or chassis at a faster rate, effectively reducing the core operating temperature and ensuring the stable operation of the equipment under heavy load, as well as extending the service life.
 

In addition to its top-notch heat-conducting ability, this product also offers comprehensive reliability guarantees:
 

Superior electrical insulation: The breakdown voltage is as high as ≥ 5500 V/mm (according to ASTM D149), and combined with a high volume resistivity of ≥ 1.0×10¹² Ohm-cm (according to ASTM D257), it provides a robust electrical safety barrier for high-power circuits.
 

Wide temperature range stability: The recommended operating temperature range covers -40°C to 200°C, enabling it to handle extreme conditions with cold and heat shocks without performance degradation.
 

Highest safety certification: Meets both UL 94 V-0 (certification number E3311000) and ISO standard V-0 flame retardant level, ensuring excellent fire safety performance when used in harsh environments.
 

Optimize physical properties: With a moderate 50 Shore 00 hardness (in accordance with ASTM D2240) and flexible thickness options (customizable from 0.5mm to 5.0mm, in accordance with ASTM D374), it can fully fill the microscopic irregularities of the interface while maintaining good construction flexibility.
 

Application scenario: Empowering the next generation of high-power electronic design
 

TIF™ 500-75-11U is an engineering material specifically designed for challenging heat dissipation applications. Its typical application scenarios include, but are not limited to:
New energy vehicles: Electric drive inverter (IGBT/SiC power module), on-board charger (OBC), battery management system (BMS) for heat conduction and insulation.
Communication infrastructure: 5G/6G base station AAU, optical modules, data center switches and server CPU/GPU for heat management.
Energy and industry: Power devices in photovoltaic inverters, industrial frequency converters, energy storage systems (BESS) for heat dissipation and insulation.
High-end consumer electronics: High-performance gaming laptops, AR/VR devices, flagship smartphone chipsets for heat solutions.