Thermal Conductive Pad terlihat dan bekerja dengan sangat baik. Kami tidak membutuhkan Thermal Conductive Pad lainnya sekarang!
—— Peter Goolsby
Saya telah bekerja sama dengan Ziitek selama 2 tahun, mereka menyediakan bahan konduktif termal berkualitas tinggi, dan pengiriman tepat waktu, merekomendasikan bahan perubahan fasa mereka
—— Antonello Sau
Kualitas yang baik, pelayanan yang baik. Tim Anda selalu memberi kami bantuan dan penyelesaian, berharap kami akan menjadi mitra yang baik sepanjang waktu!
1.5 W/m-K High Temperature LED Gap Pad Thermal Conductive Silicone Pad for Electronic components Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal ... Baca lebih lanjut
Soft and compressible for low stress applications 1.5mmT silicone sheets for Mass storage devices The TIF160-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows ... Baca lebih lanjut
Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad TIF® 100 5030-05 Series TIF® 100 5030-05 Series is a well-balanced, general-purpose thermal pad ... Baca lebih lanjut
High Compliance 1.5W Thermally Conductive Gap Filler Pads For AI Processors AI Servers Heat Dissipation The TIF®100-15-14S Series is a well-balanced, general-purpose thermal pad.It offers good thermal ... Baca lebih lanjut
Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI The TIF®100-40-11US Series is an ultra-soft thermal interface material designed specifically to protect ... Baca lebih lanjut
Thermal Gap Filler Designed To Improve Thermal Conductivity And Extend Service Life Of Electronic Components Product Overview The TIF® 100-30-15S Series is a well-balanced, general-purpose thermal pad offering ... Baca lebih lanjut
Company pfofile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you ... Baca lebih lanjut
Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity The TIF®100-30-02US thermally conductive interface materials are applied to fill the air gaps between the heating ... Baca lebih lanjut
0.5mm Thickness Fiberglass Reinforced Thermal Gap Filler Pad with 1.5 W/m-K Thermal Conductivity for Tablet PC Product Overview The TIF® 140FG-05S is engineered for efficient gap heat transfer, filling gaps and ... Baca lebih lanjut