Thermal Conductive Pad terlihat dan bekerja dengan sangat baik. Kami tidak membutuhkan Thermal Conductive Pad lainnya sekarang!
—— Peter Goolsby
Saya telah bekerja sama dengan Ziitek selama 2 tahun, mereka menyediakan bahan konduktif termal berkualitas tinggi, dan pengiriman tepat waktu, merekomendasikan bahan perubahan fasa mereka
—— Antonello Sau
Kualitas yang baik, pelayanan yang baik. Tim Anda selalu memberi kami bantuan dan penyelesaian, berharap kami akan menjadi mitra yang baik sepanjang waktu!
Ultra Thin LED Flat Light Thermal Adhesive Tape 0.8 W / mK with Double Sided Adhesive The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumptio... Baca lebih lanjut
Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength The TIA® 800AL Series is widely used for bonding heat sinks to microprocessors and other ... Baca lebih lanjut
Double Sided Thermal Adhesive Tape For Heatsink Product Overview The TIA® 800FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconductors. These tapes have strong ... Baca lebih lanjut
Stable Operation Over A Wide Temperature Range White 0.8W/MK Thermal Conductivity Double-Sided Adhesive Tape For Power Device The TIA®804 Series is filled with good thermal conductivity ceramic particles, ... Baca lebih lanjut
Fiberglass Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA® 808FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconducto... Baca lebih lanjut
The TIA™810 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low ... Baca lebih lanjut
High Performance blue Acrylic Thermal Adhesive Tape 1.2 W/mK For Led Fluorescent Lamp 0.1~0.5mmT The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Baca lebih lanjut
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Baca lebih lanjut
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Baca lebih lanjut
Heat Sink Acrylic Based Glue - Highly Double Side Thermal Conductive Acrylic Tape For SMD LED Module The TIA® 800FG Series is widely used for bonding heat sinks to microprocessors and other power consuming ... Baca lebih lanjut