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Detail produk:
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| Nama Produk: | AI Server Thermal Pad Menawarkan Konduktivitas Termal Dan Isolasi Listrik Yang Sangat Baik Untuk Man | Suhu Pengoperasian yang Direkomendasikan (°C): | -40 hingga 200 ℃ |
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| Kekerasan: | 75 Pantai 00 | Aplikasi: | GPU/CPU/LED |
| Kekuatan Kerusakan (V/mm): | ≥5500 | Mencicipi: | Sampel gratis |
| Kata kunci: | Bantalan Termal Isolasi Elektrik | Konduktivitas Termal(w/mk): | 3.0w/mk |
| Konstruksi: | Elastomer silikon berisi keramik | Peringkat Api: | UL 94 V-0 |
| Menyoroti: | electrically insulating thermal pad,custom size thermal gap filler,GPU CPU LED heat dissipation pad |
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Customized Electrically Insulating Thermal Pad 1.5-16W/mK Heat Dissipation OEM Custom Size For GPU/CPU/LED Product Overview The TIF® 100-30-01UF Series is a structurally supportive thermal pad designed to provide high heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. This product is ideal for applications requiring a
Kontak Person: Dana Dai
Tel: +86 18153789196