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Detail produk:
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| Nama Produk: | Konduktivitas Termal Tinggi 8.0W/MK Bantalan Pengisi Celah Konduktif Termal Dielektrik Rendah untuk | Suhu Pengoperasian yang Direkomendasikan (°C): | -40 hingga 200 ℃ |
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| Kekerasan: | 85 Pantai 00 | Kekuatan Kerusakan (V/mm): | ≥3000 |
| Mencicipi: | Sampel gratis | Konstruksi: | Elastomer silikon berisi keramik |
| Kata kunci: | Pad termal konduktivitas tinggi | Konduktivitas Termal(w/mk): | 8,0W/mK |
| Peringkat Api: | UL 94 V-0 | Aplikasi: | Komponen Gelombang Mikro Semikonduktor |
| Menyoroti: | High thermal conductivity gap filler pads,Thermally conductive pads for semiconductors,Low dielectric thermal gap filler |
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High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components Product Overview The TIF® 100N 8085-06 Series is a thermal pad that combines excellent heat dissipation performance with reliable structural support capability. It can fill interface gaps, establish efficient thermal conduction pathways, and provide stable mechanical support for stacked or adjacent electronic components, effectively meeting long-term
Kontak Person: Dana Dai
Tel: +86 18153789196