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Rumah ProdukThermal Gap Filler

Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Designed For Heat Management In Electronics And AI Service

Sertifikasi
Cina Dongguan Ziitek Electronical Material and Technology Co., Ltd Sertifikasi
Cina Dongguan Ziitek Electronical Material and Technology Co., Ltd Sertifikasi
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Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Designed For Heat Management In Electronics And AI Service

Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Designed For Heat Management In Electronics And AI Service
Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Designed For Heat Management In Electronics And AI Service Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Designed For Heat Management In Electronics And AI Service Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Designed For Heat Management In Electronics And AI Service

Gambar besar :  Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Designed For Heat Management In Electronics And AI Service

Detail produk:
Tempat asal: Cina
Nama merek: ZIITEK
Sertifikasi: UL and RoHs
Nomor model: TIF100-15-01E
Dokumen: TIF100-15-01E_Data Sheet.pdf
Syarat-syarat pembayaran & pengiriman:
Kuantitas min Order: 1000 buah
Harga: Dapat dinegosiasikan
Kemasan rincian: 1000 buah/tas
Waktu pengiriman: 3-7 hari kerja
Syarat-syarat pembayaran: T/T
Menyediakan kemampuan: 10000/hari

Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Designed For Heat Management In Electronics And AI Service

Deskripsi
Nama produk: Bantalan Termal Silikon Dengan Konduktivitas Termal 1,5W/mK Dirancang Untuk Manajemen Panas Dalam La Kata kunci: Bantalan termal silikon
Terus Gunakan Temp: -40 ℃ hingga 200 ℃ Kepadatan: 2,3g/cm³
Kekerasan: 65/35 Pantai 00 Warna: Hitam
Konduktivitas termal: 1,5W/mK Ketebalan: 0,010~0,200 inci / 0,25~5,00mmT
Konstruksi: Elastomer silikon berisi keramik Aplikasi: Dalam Layanan Elektronik Dan AI
Menyoroti:

Silicone thermal pad for electronics

,

1.5W/mK thermal conductivity pad

,

AI service thermal gap filler

Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Product Overview The TIF® 100-15-01E Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Key Features Good thermal conductivity Moldability

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

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All Reviews

D
Dante
Poland Jul 20.2026
These worked so well, I came back for more. I have a mini pc with passive cooling. When it heats up, the case/heat sink separates slightly from the CPU causing the CPU temps to increase drastically. These thermal pads filled the gap giving me consistent CPU temperatures. I also used them for LAN and NVME drives.
Rincian kontak
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Kontak Person: Dana Dai

Tel: +86 18153789196

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