logo
Quote request suatu |
Rumah ProdukThermal Gap Filler

Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

Semua produk

Bahan Pengubah Fase

(41)

Thermal Conductive Pad

(243)

Thermal Gap Filler

(253)

Gemuk Konduktif Termal

(28)

Bahan Isolasi Termal

(47)

Lembar Grafit Termal

(54)

Pita Perekat Termal

(44)

Lem Konduktif Termal

(12)

Perekat Konduktif Termal

(13)

Plastik Konduktif Termal

(20)

Bahan Busa Spons

(10)

PET Double Sided Tape

(8)

Thermal Gap Pad

(403)

Gel Konduktif Panas

(25)

Gasket Busa Silikon

(13)

Silicone Free Gap Filler Pad

(15)

Bahan Penyerap Perisai

(19)

Konduktivitas Termal Logam tajam

(0)
Produk terbaik
Filler konduktif termal

Filler konduktif termal

Suhu Tinggi Thermal Gap Filler, Garnet 6 W / mK Termal Konduktif lembaran karet silikon 50 shore00

Suhu Tinggi Thermal Gap Filler, Garnet 6 W / mK Termal Konduktif lembaran karet silikon 50 shore00

Conductive thermal gap filler Untuk Aplikasi Elektronik Daya 1,5 W / MK

Conductive thermal gap filler Untuk Aplikasi Elektronik Daya 1,5 W / MK

Sertifikasi
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
Ulasan pelanggan
Thermal Conductive Pad terlihat dan bekerja dengan sangat baik. Kami tidak membutuhkan Thermal Conductive Pad lainnya sekarang!

—— Peter Goolsby

Saya telah bekerja sama dengan Ziitek selama 2 tahun, mereka menyediakan bahan konduktif termal berkualitas tinggi, dan pengiriman tepat waktu, merekomendasikan bahan perubahan fasa mereka

—— Antonello Sau

Kualitas yang baik, pelayanan yang baik. Tim Anda selalu memberi kami bantuan dan penyelesaian, berharap kami akan menjadi mitra yang baik sepanjang waktu!

—— Chris Rogers

I 'm Online Chat Now

Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices
Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices
Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

Gambar besar :  Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

Detail produk:
Tempat asal: Cina
Nama merek: ZIITEK
Sertifikasi: UL and RoHs
Nomor model: TIF100L 3040-06
Dokumen: TIF100L 3040-06_Data Sheet.pdf
Syarat-syarat pembayaran & pengiriman:
Kuantitas min Order: 1000 buah
Harga: Dapat dinegosiasikan
Kemasan rincian: 1000 buah/tas
Waktu pengiriman: 3-5 hari kerja
Syarat-syarat pembayaran: T/T
Menyediakan kemampuan: 10000/hari
Kontak

Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

Deskripsi
Nama Produk: Bantalan Pengisi Celah Termal Volatilitas Rendah Memastikan Manajemen Termal Dan Stabilitas Operasi Konstruksi: Elastomer silikon berisi keramik
Kata kunci: bantalan pengisi celah termal Kekerasan: 65/40 Pantai 00
Suhu Pengoperasian yang Direkomendasikan (°C): -40 hingga 200 ℃ Tegangan Kerusakan: ≥5500
Mencicipi: Sampel gratis Konduktivitas Termal（w/mk）: 3.0w/mk
Peringkat Api: UL 94 V-0 Aplikasi: Perangkat Elektronik

Low Volatility Thermal Gap Filler Pads
Product Overview

The TIF®100L 3040-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices. This material balances efficient thermal conductivity with extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components and precision circuits.The material features excellent flexibility and elasticity, enabling it to fully fill micro gaps between heating interfaces and heat dissipation structures. This significantly reduces contact thermal resistance, improves thermal conductivity efficiency, and ensures the reliability and service life of electronic components in long-term operation.

Key Features
  • Ultra low volatility of siloxane
  • Good thermal conductivity
  • Excellent weather resistance and aging resistance
  • Highly compressible, easy to install and operate
  • Good insulation performance
Applications
  • Motor Controller (MCU)
  • Airborne computer
  • Machine vision camera
  • High performance ASIC chip
  • Central control screen
Technical Specifications of TIF100L 3040-06 Series
Property Value Test Method
Color White Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 3.0 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00		 ASTM D374
Hardness (Shore 00) 65 | 40 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Volume Resistivity (Ohm-meter) ＞1.0×10¹² ASTM D257
Flame rating V-0 UL 94 (E331100)
∑ZD3-D10 (PPM) ＜100 GC-MS
Thermal conductivity (W/m-K) 3.0 ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm), with increments of 0.010" (0.25 mm).

Standard Size: 16"×16" (406 mm×406 mm)

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

TIF 100L 3040-06 Thermal Gap Filler Pad product photo
Packaging & Lead Time

Packaging Details:

  • With PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time:

Quantity: 5000 pieces

Estimated Time: To be negotiated

Frequently Asked Questions
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
Q: Are you trading company or manufacturer?
A: We are manufacturer in China.

Label:

pengisi termal konduktif,

konduktivitas termal silikon,

bahan perubahan fase suhu tinggi

Rincian kontak
Dongguan Ziitek Electronic Materials & Technology Ltd.

Kontak Person: Dana Dai

Tel: +86 18153789196

Mengirimkan permintaan Anda secara langsung kepada kami (0 / 3000)

Tentang

Thermal Gap Filler

Ultra Soft Thermal Gap Filler TIF4120 Untuk Perangkat Keras Telekomunikasi

Pad Konduktif Termal Thermal Thermal Thermal Termal Tertinggi untuk Transfer Panas Elektronik

Grey Color Thermal Gap Filler Pads TIF8120 Untuk Wireless Router Diaplikasikan

Lembar Grafit Termal

TIR300CU Copper Composite Carbon Nano Coating lembaran grafit termal

Black Thermal Graphite Sheet 10.0W / mK untuk peralatan konversi daya

TIRTM380-CU-T2 konduktivitas tinggi 320W CU coating Thermal Graphite Sheet 85 ShoreA 0.080mmT untuk panel pasokan Plasma

Tinggalkan pesan

Kebijakan pribadi | Cina Bagus kualitas Bahan Pengubah Fase pemasok. © 2015 - 2026 Dongguan Ziitek Electronic Materials & Technology Ltd.. All Rights Reserved.