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Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies

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Filler konduktif termal

Filler konduktif termal

Suhu Tinggi Thermal Gap Filler, Garnet 6 W / mK Termal Konduktif lembaran karet silikon 50 shore00

Suhu Tinggi Thermal Gap Filler, Garnet 6 W / mK Termal Konduktif lembaran karet silikon 50 shore00

Conductive thermal gap filler Untuk Aplikasi Elektronik Daya 1,5 W / MK

Conductive thermal gap filler Untuk Aplikasi Elektronik Daya 1,5 W / MK

Sertifikasi
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
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Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies

Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies
Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies
Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies

Gambar besar :  Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies

Detail produk:
Tempat asal: Cina
Nama merek: ZIITEK
Sertifikasi: UL and RoHs
Nomor model: TIF100-50-50S
Dokumen: TIF100-50-50S_Data Sheet.pdf
Syarat-syarat pembayaran & pengiriman:
Kuantitas min Order: 1000 buah
Harga: Dapat dinegosiasikan
Kemasan rincian: 1000 buah/tas
Waktu pengiriman: 3-5 hari kerja
Syarat-syarat pembayaran: T/T
Menyediakan kemampuan: 10000/hari
Kontak

Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies

Deskripsi
Nama produk: Pengisi Celah Termal Menyediakan Perpindahan Panas Dan Sifat Isolasi Dan Penyegelan Untuk Rakitan El Ketebalan: 0,010"~0,200"(0,25~5,0mm)
Kata kunci: Pengisi celah termal Kekerasan: 65/45 pantai 00
Konstruksi: Elastomer silikon berisi keramik Kepadatan: 3,3 gram/cm³
Aplikasi: Perpindahan Panas Dan Sifat Isolasi Dan Penyegelan Untuk Rakitan Elektronik Kompak Konduktivitas termal: 5.0 w/mk

Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For Compact Electronic Assemblies
Product Overview

The TIF®100-50-50S Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Key Features
  • Good thermal conductivity: 5.0 W/mK
  • Moldability for complex parts
  • Soft and compressible for low stress applications
  • Easy release construction
  • Electrically isolating
  • High durability
Applications
  • Cooling components to the chassis or frame
  • High speed mass storage drives
  • Heat sinking housing at LED-lit BLU in LCD
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Notebook computers
  • Power supply units
  • Heat pipe thermal solutions
  • Memory modules
  • Mass storage devices
  • Automotive electronics
  • Set top boxes
Technical Specifications of TIF®100-50-50S Series
Property Value Test Method
Color Pink Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 3.3 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 / 0.030~0.200
0.25~0.50 / 0.75~5.00		 ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Operating Temperature (℃) -40 to 200℃ -
Breakdown Voltage (V/mm) ≥ 5500 ASTM D149
Dielectric Constant @1Mhz 7.5 ASTM D150
Volume Resistivity (Ohm-meter) ≥1.0×10¹² ASTM D257
Thermal Conductivity (W/m-K) 5.0 ASTM D5470 / ISO22007
Fire Rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm × 406 mm)

Component Codes:

  • Reinforcement Fabric: FG (Fiberglass)
  • Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
  • Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

TIF® 100-50-50S Series Thermal Gap Filler Product Image
Packaging & Lead Time

Packaging Details:

  • PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time:

Quantity: 5,000 pieces
Estimated Time: To be negotiated

Company Profile

Dongguan Ziitek Electronic Material and Technology Ltd. was established in 2006 as a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. Our product portfolio includes heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad, heat-conducting grease, heat-conducting plastic, silicone rubber, and silicone rubber foam.We adhere to the business philosophy of "survival by quality, development by quality," and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Certifications
ISO9001:2015 ISO14001:2004 IATF16949:2016 IECQ QC 080000:2017 UL

Label:

pengisi termal konduktif,

konduktivitas termal silikon,

bahan perubahan fase suhu tinggi

Rincian kontak
Dongguan Ziitek Electronic Materials & Technology Ltd.

Kontak Person: Dana Dai

Tel: +86 18153789196

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