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Rumah ProdukThermal Gap Filler

Thermal Pad Expert 6.5W/mK Gap Filler Pad Thermal Interface Material For Gap Filling Applications

Sertifikasi
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
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Thermal Pad Expert 6.5W/mK Gap Filler Pad Thermal Interface Material For Gap Filling Applications

Thermal Pad Expert 6.5W/mK Gap Filler Pad Thermal Interface Material For Gap Filling Applications
Thermal Pad Expert 6.5W/mK Gap Filler Pad Thermal Interface Material For Gap Filling Applications Thermal Pad Expert 6.5W/mK Gap Filler Pad Thermal Interface Material For Gap Filling Applications Thermal Pad Expert 6.5W/mK Gap Filler Pad Thermal Interface Material For Gap Filling Applications

Gambar besar :  Thermal Pad Expert 6.5W/mK Gap Filler Pad Thermal Interface Material For Gap Filling Applications

Detail produk:
Tempat asal: Cina
Nama merek: ZIITEK
Sertifikasi: UL and RoHs
Nomor model: TIF100-65-11AS
Dokumen: TIF100-65-11US_Data Sheet .... ..pdf
Syarat-syarat pembayaran & pengiriman:
Kuantitas min Order: 1000 buah
Harga: Dapat dinegosiasikan
Kemasan rincian: 1000 buah/tas
Waktu pengiriman: 3-5 hari kerja
Syarat-syarat pembayaran: T/T
Menyediakan kemampuan: 10000/hari

Thermal Pad Expert 6.5W/mK Gap Filler Pad Thermal Interface Material For Gap Filling Applications

Deskripsi
Nama Produk: Thermal Pad Expert 6.5W/mK Gap Filler Pad Bahan Antarmuka Termal Untuk Aplikasi Pengisian Celah Konstruksi & Komposisi: Elastomer silikon berisi keramik
Kata kunci: Bantalan pengisi celah Kekerasan: 65/20 Pantai 00
Konduktivitas termal: 6.5W/mk mencicipi: bebas
Ketebalan: Tersedia Dalam Berbagai Ketebalan Kepadatan: 3,45 gram/cm³
Aplikasi: Aplikasi Pengisian Kesenjangan

Thermal Pad Expert 6.5W/mK Gap Filler Pad Thermal Interface Material For Gap Filling Applications


Products description


The TIF®100-65-11US  Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:


> Good thermal conductivity :6.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses


Applications:


> Home applince industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures

> Audio and video components 
> IT infrastructure 
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps


Typical Properties of TIF®100-65-11US Series
Property Value Test method
Color Dark gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.45 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.5 W/m-K ASTM D5470
6.5 W/m-K ISO22007
 

Products specification


Standard Thickness: 0.010"(0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size:16"×16" (406 mm×406 mm).


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Thermal Pad Expert 6.5W/mK Gap Filler Pad Thermal Interface Material For Gap Filling Applications 0

Company Profile


Ziitek Electronic Material and Technology Ltd(ZIITEK) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.


FAQ:


Q: How do I place an order? 

A:1. Click the "Sent messages" button to continue with the process. 

2. Fill out the message form by entering a subject line, and message to us.  

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us 

4. We will reply you as soon as possible with Email or online 


Q: How do I request customized samples? 

A: To request samples, you can leave us message on website, or just contact us by send email or call us. 


Q: What's the thermal conductivity test method given on the data sheet ? 

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Rincian kontak
Dongguan Ziitek Electronic Materials & Technology Ltd.

Kontak Person: Dana Dai

Tel: +86 18153789196

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