logo
Rumah ProdukThermal Conductive Pad

Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle

Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
Thermal Conductive Pad terlihat dan bekerja dengan sangat baik. Kami tidak membutuhkan Thermal Conductive Pad lainnya sekarang!

—— Peter Goolsby

Saya telah bekerja sama dengan Ziitek selama 2 tahun, mereka menyediakan bahan konduktif termal berkualitas tinggi, dan pengiriman tepat waktu, merekomendasikan bahan perubahan fasa mereka

—— Antonello Sau

Kualitas yang baik, pelayanan yang baik. Tim Anda selalu memberi kami bantuan dan penyelesaian, berharap kami akan menjadi mitra yang baik sepanjang waktu!

—— Chris Rogers

I 'm Online Chat Now

Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle

Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle

Gambar besar :  Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle

Detail produk:
Tempat asal: Cina
Nama merek: ZIITEK
Sertifikasi: UL and RoHs
Nomor model: TIF100-50-11ES
Syarat-syarat pembayaran & pengiriman:
Kuantitas min Order: 1000 buah
Harga: Dapat dinegosiasikan
Kemasan rincian: 1000 buah/tas
Waktu pengiriman: 3-5 hari kerja
Syarat-syarat pembayaran: T/T
Menyediakan kemampuan: 100000pcs/hari
Detil Deskripsi produk
Nama produk: Bantalan Termal Ultra Lembut Impedansi Termal Rendah Untuk 5G, Aerospace, AI, Kendaraan Listrik Ketebalan: 0,010"(0,25mm)~0,200"(5,0mm)
Konduktivitas termal: 5,0W/m-K Kata kunci: Bantalan Termal Ultra Lembut
Kekerasan: 10 pantai 00 Kepadatan: 3.3g/cm³
Warna: abu-abu gelap Suhu Pengoperasian yang Disarankan: -40 hingga 200 ℃
Aplikasi: 5G, Dirgantara, AI, Kendaraan Listrik

Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle

 

The TIF®100-50-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filing of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance, and providing superior thermal solutions and physical protection for the most precise and higt heat flux electronic components.

 

Features


> Good thermal conductive: 5.0W/mK 
> Moldability for complex parts
> Broad range of hardnesses available
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications


> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Home appliance industry
> CPU
> Display card
> Mainboard/mother board
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

 

Typical Properties of TIF®100-50-11ES Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.020~0.030 0.040~0.200 ASTM D374
(0.50~0.75) (1.0~5.0)
Hardness 10 Shore 00 10 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0W/m-K ASTM D5470
5.0W/m-K ISO22007

 

Product Specifications
Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.

Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle 0

Company profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

 

Thermal graphite sheet/film

 

Thermal double-sided tape

 

Thermal insulation pad

 

Thermal grease

 

Phase change material

 

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Rincian kontak
Dongguan Ziitek Electronic Materials & Technology Ltd.

Kontak Person: Dana Dai

Tel: 18153789196

Mengirimkan permintaan Anda secara langsung kepada kami (0 / 3000)