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Rumah ProdukThermal Conductive Pad

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

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Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
Thermal Conductive Pad terlihat dan bekerja dengan sangat baik. Kami tidak membutuhkan Thermal Conductive Pad lainnya sekarang!

—— Peter Goolsby

Saya telah bekerja sama dengan Ziitek selama 2 tahun, mereka menyediakan bahan konduktif termal berkualitas tinggi, dan pengiriman tepat waktu, merekomendasikan bahan perubahan fasa mereka

—— Antonello Sau

Kualitas yang baik, pelayanan yang baik. Tim Anda selalu memberi kami bantuan dan penyelesaian, berharap kami akan menjadi mitra yang baik sepanjang waktu!

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Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI
Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI
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Gambar besar :  Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

Detail produk:
Tempat asal: Cina
Nama merek: ZIITEK
Sertifikasi: UL and RoHs
Nomor model: TIF100-40-11AS
Syarat-syarat pembayaran & pengiriman:
Kuantitas min Order: 1000 buah
Harga: Dapat dinegosiasikan
Kemasan rincian: 1000 buah/tas
Waktu pengiriman: 3-5 hari kerja
Syarat-syarat pembayaran: T/T
Menyediakan kemampuan: 100000pcs/hari
Kontak
Detil Deskripsi produk
Nama produk: Bantalan Celah Termal Berbasis Silikon Konduktivitas Termal Yang Baik Untuk Komponen Elektronik 5G A Aplikasi: Komponen Elektronik 5G Aerospace AI
Ketebalan: 0,010"(0,25mm)~0,200"(5,0mm) Konduktivitas termal: 4,0W/mK
Kata kunci: bantalan celah termal Kekerasan: 65/20 Pantai 00
Kepadatan: 3,2g/cm³ Warna: abu-abu gelap
Suhu Pengoperasian yang Disarankan: -40 hingga 200 ℃

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI

 

The TIF®100-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit.It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features


> Good thermal conductive: 4.0W/mK 
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

 


Applications


> Cpu heat sinking 
> High speed mass storage drives
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Home appliance industry
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

 

 

Typical Properties of TIF®100-40-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 4.0W/m-K ASTM D5470
4.0W/m-K ISO22007

 

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm)
with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.

Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI 0

Company profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

 

Thermal graphite sheet/film

 

Thermal double-sided tape

 

Thermal insulation pad

 

Thermal grease

 

Phase change material

 

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

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This message should include any questions you might have about the products as well as your purchase requests.

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4. We will reply you as soon as possible with Email or online.

Label:

bahan konduktif termal,

pad konduktif termal,

cpu thermal pad

Rincian kontak
Dongguan Ziitek Electronic Materials & Technology Ltd.

Kontak Person: Dana Dai

Tel: 18153789196

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