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Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers

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Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi

Thermal Conductive Pad terlihat dan bekerja dengan sangat baik. Kami tidak membutuhkan Thermal Conductive Pad lainnya sekarang!

—— Peter Goolsby

Saya telah bekerja sama dengan Ziitek selama 2 tahun, mereka menyediakan bahan konduktif termal berkualitas tinggi, dan pengiriman tepat waktu, merekomendasikan bahan perubahan fasa mereka

—— Antonello Sau

Kualitas yang baik, pelayanan yang baik. Tim Anda selalu memberi kami bantuan dan penyelesaian, berharap kami akan menjadi mitra yang baik sepanjang waktu!

—— Chris Rogers

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Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers

Gambar besar : Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers

Detail produk:

Tempat asal:	Cina
Nama merek:	ZIITEK
Sertifikasi:	UL and RoHs
Nomor model:	TIF100-40-11E

Syarat-syarat pembayaran & pengiriman:

Kuantitas min Order:	1000 buah
Harga:	Dapat dinegosiasikan
Kemasan rincian:	1000 buah/tas
Waktu pengiriman:	3-5 hari kerja
Syarat-syarat pembayaran:	T/T
Menyediakan kemampuan:	10000/hari

Kontak

Detil Deskripsi produk

Nama Produk:	Kinerja Isolasi Yang Baik Bantalan Pengisi Celah Konduktif Termal Ultra-Lembut Untuk Prosesor AI Ser	Konduktivitas & Komposisi Termal:	4,0W/mK
Kata kunci:	bantalan celah termal	Aplikasi:	Server AI Prosesor AI
Kepadatan:	3,1g/cm³	Kekerasan:	65/35 Pantai 00
Warna:	Abu-abu gelap	Ketebalan:	0,020 "(0,5mm) ~ 0,200" (5.0mm)
Konstruksi:	Elastomer silikon berisi keramik	Terus Gunakan Temp:	-45 ℃ hingga 200 ℃

Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers

TIF^®100-40-11E Series is a wellbalanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Features:

> Higt thermal conductivity 4.0W/mK
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

Applications

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

Typical Properties of TIF^®100-40-11E Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.1		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.0)
Hardness	65 Shore 00	35 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	6.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹²Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	4.0 W/m-K		ASTM D5470
	4.0 W/m-K		ISO22007

Product Specifications
Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25mm)
Standard Size:16"X16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.