Rumah Produk Thermal Conductive Pad

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Semua produk

Bahan Pengubah Fase (39)

Thermal Conductive Pad (222)

Thermal Gap Filler (219)

Gemuk Konduktif Termal (27)

Bahan Isolasi Termal (46)

Lembar Grafit Termal (54)

Pita Perekat Termal (44)

Lem Konduktif Termal (12)

Perekat Konduktif Termal (11)

Plastik Konduktif Termal (20)

Bahan Busa Spons (10)

PET Double Sided Tape (8)

Thermal Gap Pad (403)

Gel Konduktif Panas (24)

Gasket Busa Silikon (12)

Silicone Free Gap Filler Pad (14)

Bahan Penyerap Perisai (19)

Konduktivitas Termal Logam tajam (0)

Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi

Thermal Conductive Pad terlihat dan bekerja dengan sangat baik. Kami tidak membutuhkan Thermal Conductive Pad lainnya sekarang!

—— Peter Goolsby

Saya telah bekerja sama dengan Ziitek selama 2 tahun, mereka menyediakan bahan konduktif termal berkualitas tinggi, dan pengiriman tepat waktu, merekomendasikan bahan perubahan fasa mereka

—— Antonello Sau

Kualitas yang baik, pelayanan yang baik. Tim Anda selalu memberi kami bantuan dan penyelesaian, berharap kami akan menjadi mitra yang baik sepanjang waktu!

—— Chris Rogers

I 'm Online Chat Now

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Gambar besar : Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Detail produk:

Tempat asal:	Cina
Nama merek:	ZIITEK
Sertifikasi:	UL and RoHs
Nomor model:	TIF100-50-11U

Syarat-syarat pembayaran & pengiriman:

Kuantitas min Order:	1000 buah
Harga:	Dapat dinegosiasikan
Kemasan rincian:	1000 buah/tas
Waktu pengiriman:	3-5 hari kerja
Syarat-syarat pembayaran:	T/T
Menyediakan kemampuan:	100000pcs/hari

Kontak

Detil Deskripsi produk

Nama produk:	Bahan PAD GAP Termal Ultra Lembut Berbasis Silikon Untuk Prosesor AI Server AI	Konduktivitas termal:	5,0W/m-K
Kata kunci:	Bahan PAD GAP Termal	Peringkat Api:	UL 94 V-0
Aplikasi:	Server AI Prosesor AI	Kekerasan:	27 pantai 00
Terus Gunakan Temp:	-40 hingga 200 ℃	Berat jenis:	3.4g/cc
Konstruksi:	Elastomer silikon berisi keramik

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

TIF^®100-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Application:

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

Typical Properties of The TIF^®100-50-11U Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.4		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.5)	(0.75~5.0)
Hardness	65 Shore 00	27 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	5.0 W/m-K		ASTM D5470
	5.0 W/m-K		ISO22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers 0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Label: