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Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers

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Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi

Thermal Conductive Pad terlihat dan bekerja dengan sangat baik. Kami tidak membutuhkan Thermal Conductive Pad lainnya sekarang!

—— Peter Goolsby

Saya telah bekerja sama dengan Ziitek selama 2 tahun, mereka menyediakan bahan konduktif termal berkualitas tinggi, dan pengiriman tepat waktu, merekomendasikan bahan perubahan fasa mereka

—— Antonello Sau

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—— Chris Rogers

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Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers

Gambar besar : Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers

Detail produk:

Tempat asal:	Cina
Nama merek:	ZIITEK
Sertifikasi:	UL and RoHs
Nomor model:	TIF100-50-10E

Syarat-syarat pembayaran & pengiriman:

Kuantitas min Order:	1000 buah
Harga:	Dapat dinegosiasikan
Kemasan rincian:	1000 buah/tas
Waktu pengiriman:	3-5 hari kerja
Syarat-syarat pembayaran:	T/T
Menyediakan kemampuan:	100000pcs/hari

Kontak

Detil Deskripsi produk

Nama produk:	Impedansi Termal Rendah 5.0W Bantalan Termal Ultra Lembut Untuk Komputasi Awan Dan Server	Kata kunci:	Bantalan Termal Ultra Lembut
Peringkat Api:	UL 94 V-0	Kekerasan:	35 pantai 00
Konduktivitas termal:	5,0W/m-K	Terus Gunakan Temp:	-40 hingga 200 ℃
Berat jenis:	3.4g/cc	Aplikasi:	Komputasi Awan dan Server

Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers

TIF^®100-50-10E Ultra Soft Thermal Pad

High thermal conductivity
Low thermal impedance
Good electrical insulation

This thermal pad's ultra-soft texture can effectively fill the gaps between electronic components and heat sinks, achieving a seamless fit.

Feature

Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, TIF^®100-50-10E Ultra Soft Thermal Pad have outstanding thermal conductivity (5.0 W/m·K) and achieve an ultra-soft texture of Shore OO 35/65. Only a light amount of pressure is needed to achieve a seamless fit and fill the gaps between electronic components and heat sinks. This enables quicker and more effective heat dissipation, enhancing overall cooling performance.

Application:

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

Typical Properties of The TIF^®100-50-10E Series
Property	Value		Test method
Color	Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.4		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.5)	(0.75~5.0)
Hardness	65 Shore 00	35 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	6.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	5.0 W/m-K		ASTM D5470
	5.0 W/m-K		ISO22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers 0