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Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad for 5G Aerospace AI AIoT And Automotive

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Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi

Thermal Conductive Pad terlihat dan bekerja dengan sangat baik. Kami tidak membutuhkan Thermal Conductive Pad lainnya sekarang!

—— Peter Goolsby

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Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad for 5G Aerospace AI AIoT And Automotive

Gambar besar : Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad for 5G Aerospace AI AIoT And Automotive

Detail produk:

Tempat asal:	Cina
Nama merek:	ZIITEK
Sertifikasi:	UL and RoHs
Nomor model:	TIF100 3030-06

Syarat-syarat pembayaran & pengiriman:

Kuantitas min Order:	1000 buah
Harga:	Dapat dinegosiasikan
Kemasan rincian:	1000 buah/tas
Waktu pengiriman:	3-5 hari kerja
Syarat-syarat pembayaran:	T/T
Menyediakan kemampuan:	100000pcs/hari

Kontak

Detil Deskripsi produk

Nama produk:	Konduktivitas Termal Bantalan Termal Ultra Lembut 3,0W/Mk Untuk 5G Aerospace AI AIoT Dan Otomotif	Peringkat Api:	UL 94 V-0
Kekerasan:	30 Pantai 00	Aplikasi:	5G Aerospace AI AIoT Dan Otomotif
Konduktivitas termal:	3,0W/mK	Terus Gunakan Temp:	-40 hingga 200 ℃
Berat jenis:	3.0g/cc	Kata kunci:	Bantalan Termal Ultra Lembut

Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive

The TIF^®100 3030-06 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness,achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

Company Profile

A silicone thermal pad is a type of thermal interface material (TIM) which is highly conductive and comprises of conformable materials which are used to provide a heat path between heat sinks and electronic devices where uneven surface topography, air gaps and texture preclude good thermal transfer. Ziitek supply a wide range of silicone thermal pads with varying properties to suit every application.

Features

> Good thermal conductive: 3.0W/mK
> Ultra-soft and highly conformable
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance

Applications

Electronic Components,5G,Aerospace,AI, AIoT, AR/VR/MR/XR, Automotive,
Consumer Devices,Datacom,Electric Vehicle,Electronic Products,Energy
Storage,Industrial, Lighting Equipment,Medical, Military,Netcom,Panel, Power
Electronics,Robot,Servers,Smart Home,Telecom,etc.

Typical Properties of The TIF^®100 3030-06 Series
Property	Value		Test method
Color	Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.5)	(0.75~5.0)
Hardness	65 Shore 00	30 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	5.8 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	3.0 W/m-K		ASTM D5470
	3.0 W/m-K		ISO22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad for 5G Aerospace AI AIoT And Automotive 0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Label:

bahan konduktif termal,

pad konduktif termal,

cpu thermal pad

Rincian kontak

Dongguan Ziitek Electronic Materials & Technology Ltd.

Kontak Person: Dana Dai

Tel: 18153789196

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