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Rumah ProdukThermal Conductive Pad

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
Thermal Conductive Pad terlihat dan bekerja dengan sangat baik. Kami tidak membutuhkan Thermal Conductive Pad lainnya sekarang!

—— Peter Goolsby

Saya telah bekerja sama dengan Ziitek selama 2 tahun, mereka menyediakan bahan konduktif termal berkualitas tinggi, dan pengiriman tepat waktu, merekomendasikan bahan perubahan fasa mereka

—— Antonello Sau

Kualitas yang baik, pelayanan yang baik. Tim Anda selalu memberi kami bantuan dan penyelesaian, berharap kami akan menjadi mitra yang baik sepanjang waktu!

—— Chris Rogers

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Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Gambar besar :  Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Detail produk:
Tempat asal: Tiongkok
Nama merek: ZIITEK
Sertifikasi: UL and RoHs
Nomor model: TIF600P
Syarat-syarat pembayaran & pengiriman:
Kuantitas min Order: 1000 buah
Harga: Dapat dinegosiasikan
Kemasan rincian: 1000pcs/tas
Waktu pengiriman: 3-5 hari
Menyediakan kemampuan: 100000pcs/hari
Detil Deskripsi produk
Nama Produk: Bantalan Pengisi Celah Konduktivitas Termal Ultra Tinggi Untuk Server AI Kata kunci: pad pengisi celah termal
Kekerasan: 60 pantai00 Konstanta dielektrik @1MHz: 4.5
Mencicipi: Sampel gratis Warna: batu delima
Konduktivitas Termal: 6,0 W/mK Kepadatan (g/cm³): 3.4
Aplikasi: Server AI

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


The TIF®600P Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between costand performance.
 
Features:

> High thermal conductivity: 6.0W/mK

> Good flexibility and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Available in varies thicknesses
> Broad range of hardnesses available

> Outstanding thermal performance


Applications

 

>  AI Servers, Inverters, Telecom Devices

>  Power tools
>  Network communication products
>  Electric vehicle batteries Computer CPU/GPU Cooling
>  New energy vehicle power systems

>  Signal communication
>  New energy vehicle
>  Motherboard chip
>  Radiator

> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power

> SMD LED module
> LED Flesible strip, LED bar
> Routers
> Medical Devices

Typical Properties of TIF®600P Series
Property Value Test method
Color Garnet Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.75)

0.040~0.200 (1.0~5.0) ASTM D374
Hardness 60 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >4.2X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.0 W/m-K ASTM D5470

6.0 W/m-K

ISO22007

 

Product Specifications


Standard Thickness: 0.020"(0.5 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)


Component Codes:

 

Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

Notes: FG (Fiberglass) provides enhanced strength,
suitable for materials with thicknesses of 0.010" to 0.020" (0.25mm to 0.50mm)

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Ultra High Thermal Conductivity Gap Filler Pad For AI Servers 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

FAQ

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Rincian kontak
Dongguan Ziitek Electronic Materials & Technology Ltd.

Kontak Person: Dana Dai

Tel: 18153789196

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