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Rumah ProdukThermal Gap Filler

1.5mm To 5.0mm Thick 1.5W High Thermal Conductivity Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad

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Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Sertifikasi
Thermal Conductive Pad terlihat dan bekerja dengan sangat baik. Kami tidak membutuhkan Thermal Conductive Pad lainnya sekarang!

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—— Antonello Sau

Kualitas yang baik, pelayanan yang baik. Tim Anda selalu memberi kami bantuan dan penyelesaian, berharap kami akan menjadi mitra yang baik sepanjang waktu!

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1.5mm To 5.0mm Thick 1.5W High Thermal Conductivity Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad

1.5mm To 5.0mm Thick 1.5W High Thermal Conductivity Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad
1.5mm To 5.0mm Thick 1.5W High Thermal Conductivity Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad
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Gambar besar :  1.5mm To 5.0mm Thick 1.5W High Thermal Conductivity Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad

Detail produk:
Tempat asal: CINA
Nama merek: ZIITEK
Sertifikasi: UL and RoHs
Nomor model: Seri TIF100-10E
Syarat-syarat pembayaran & pengiriman:
Kuantitas min Order: 1000 pcs
Harga: Dapat dinegosiasikan
Kemasan rincian: 1000pcs/tas
Waktu pengiriman: 3-5 hari kerja
Menyediakan kemampuan: 100000pcs/hari
Kontak
Detil Deskripsi produk
Nama Produk: Bantalan Silikon Lembut Konduktivitas Termal Tinggi 1.5W Tebal 1.5Mm Hingga 5.0Mm untuk CPU GPU Semi Kata kunci: Pad termal
Konduktivitas termal: 1,5W/mK Warna: Abu-abu
Suhu penggunaan terus menerus: -45 hingga 200℃ Mencicipi: Sampel gratis
Ketebalan: 0,020 "(0,5mm) ~ 0,200" (5.0mm) Kekerasan: 35 pantai 00
Aplikasi: Pembuangan Panas Semikonduktor GPU CPU

1.5mm To 5.0mm Thick 1.5W High Thermal Conductivity Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad

 

The TIF®100-10E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features


> Good thermal conductive: 1.5W/mK 
> Moldability for complex parts
> Soft and compressible for low stress applications
> Outstanding thermal performance
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available


Applications


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions

 

Typical Properties of TIF®100-10E Series
Property Value Test method
Color Gray ******
Construction &Compostion Ceramic filled silicone elastomer ******
Thickness range 0.020"(0.5mm)~0.200"(0.50mm) ASTM D374
Specific Gravity 2.3g/cc ASTM D297
Hardness 35 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage > 5500 VAC ASTM D149
Dielectric Constant 4.7 MHz ASTM D150
Volume Resistivity 2.0 X1012 Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Outgassing(TML) 0.35% ASTM E595
Thermal conductivity 1.5 W/m-K ASTM D5470

 

Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.

1.5mm To 5.0mm Thick 1.5W High Thermal Conductivity Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

1.5mm To 5.0mm Thick 1.5W High Thermal Conductivity Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad 1

Label:

pengisi termal konduktif,

konduktivitas termal silikon,

bahan perubahan fase suhu tinggi

Rincian kontak
Dongguan Ziitek Electronic Materials & Technology Ltd.

Kontak Person: Dana Dai

Tel: 18153789196

Mengirimkan permintaan Anda secara langsung kepada kami (0 / 3000)

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