Thermal Conductive Pad terlihat dan bekerja dengan sangat baik. Kami tidak membutuhkan Thermal Conductive Pad lainnya sekarang!
—— Peter Goolsby
Saya telah bekerja sama dengan Ziitek selama 2 tahun, mereka menyediakan bahan konduktif termal berkualitas tinggi, dan pengiriman tepat waktu, merekomendasikan bahan perubahan fasa mereka
—— Antonello Sau
Kualitas yang baik, pelayanan yang baik. Tim Anda selalu memberi kami bantuan dan penyelesaian, berharap kami akan menjadi mitra yang baik sepanjang waktu!
Soft Thermal Pad Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers The TIF®100-20-19S Series is a well-balanced, general-purpose thermal pad.It offers good thermal ... Baca lebih lanjut
High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers Company Profile With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek ... Baca lebih lanjut
Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers The TIF®100 2855-10 is a general-purpose thermal pad with balanced performance. It offers high thermal conductivity and moderate ... Baca lebih lanjut
Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive The TIF®100 3030-06 Series is an ultra-soft thermal interface material designed specifically to protect precision ... Baca lebih lanjut
Ultra Soft And Good Compressibility Thermally Conductive Gap Filler Pads For 5G Aerospace AI Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech ... Baca lebih lanjut
Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal ... Baca lebih lanjut
High Performance Hardness 35 Shore OO Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR Company Profile Ziitek Electronic Material and Technology Ltd With professional R&D capabilities and many year experiences ... Baca lebih lanjut
3.0W Silicone Thermal Gap Pad For Network Communication Products TIF®500-30-11U Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced ... Baca lebih lanjut
Ultra Soft Thermal Pad 3.0W High-Performance Silicone Gap Pads For Electronic Components TIF®500-30-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environment... Baca lebih lanjut
Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling TIF®700NU is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely ... Baca lebih lanjut